IP Library Granted Patent US 10,237,980
Granted Patent B2
US 10,237,980 · App. 15/103,991 · Granted Mar 19, 2019

Flexible substrate with conductive layer for mounting LED arrays

Inventors: Frederic Stephane Diana (Santa Clara, CA); Patrick Allen Bournes (Santa Clara, CA); Walter Daeschner (San Jose, CA); Yong Seok Choi (Cupertino, CA); Axel Mehnert (Mountain View, CA); Mohiuddin Mala (San Jose, CA)
Assignee: Lumileds LLC
H05K3/303H05K1/0293H05K3/04H01L25/0753H01L33/62H01L2924/0002H05K1/189H05K3/005H05K2201/0909H05K2201/10106H05K2203/175
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Quick Facts
Patent No.
US 10,237,980
App. No.
15/103,991
Granted
Mar 19, 2019
Kind
B2
Abstract

A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Claims (11)

1. A method comprising:

providing a flexible substrate including a patterned conductive layer comprising a first conductive strip and a second conductive strip, the first conductive strip and second conductive strip each comprising a plurality of parallel strips;

mounting a first light emitting device (LED) and a second LED adjacent to the first LED on the flexible substrate with a first spacing between the first LED and the second LED such that conductive pads of the first LED and the second LED are mounted onto a same first set of parallel strips of the first and second conductive strips; and

mounting a third LED and a fourth LED adjacent to the third LED on the flexible substrate with a second spacing between the third LED and the fourth LED, such that conductive pads of the third LED and the fourth LED are mounted onto a same second set of parallel strips of the first and second conductive strips where the first set of parallel strips is different than the second set of parallel strips.

2. The method of claim 1 , wherein the substrate is a flexible polymer substrate.

3. The method of claim 1 , wherein the first, second, third, and fourth LEDs are each self-supporting.

4. The method of claim 1 , further comprising removing at least a portion of the patterned conductive layer to form a circuit based on the breaks created by removing at least a portion of the patterned conductive layer.

5. The method of claim 4 , wherein the removing of at least the portion of the patterned conductive layer includes piercing the flexible substrate at one or more select locations.

6. The method of claim 4 , further comprising arranging the first conductive strip and the second conductive strip such that an original circuit without the removal of the portion of the patterned conductive layer of the portion of the patterned conductive layer provides at least one parallel circuit arrangement of LEDs, and the circuit after the removal provides at least one series circuit arrangement of LEDs.

7. The method of claim 4 , further comprising providing conductive tabs that couple the first conductive strip and the second conductive strip and the removal of the portion of the patterned conductive layer includes removal of at least one of the conductive tabs.

8. The method of claim 4 , wherein the circuit formed by the removal of the portion of the patterned conductive layer includes at least a series-parallel arrangement of LEDs.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044792/0018 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2016
From: DIANA, FREDERIC STEPHANE; BOURNES, PATRICK ALLEN; DAESCHNER, WALTER; CHOI, YONG SEOK; MEHNERT, AXEL; MALA, MOHIUDDIN
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 040121/0052 →
Continuity (2)
Provisional Application 61917540 · Dec 18, 2013
Related Publication 20170006710A1 · Jan 5, 2017