Light emitting device with reflective sidewall

1. A device comprising:

a light emitting device comprising a substrate and a semiconductor structure comprising a light emitting layer;

a first reflective layer contacting and conforming to side surfaces of the substrate and semiconductor structure to laterally surround the light emitting device;

a wavelength converting element disposed over the light emitting device, the wavelength converting element having a top surface and sidewalls, the top surface of the wavelength converting element being higher than the top surface of the first reflective layer; and

a second reflective layer disposed adjacent a first sidewall of the wavelength converting element, but not over the top surface or a second sidewall of the wavelength converting element, such that the majority of light exits the top surface of the wavelength converting element and a majority of light impinging on the second reflective layer is reflected back into the wavelength converting element.

2. The device of claim 1 , wherein a top surface of the first reflective layer is no higher than a top surface of the substrate.

3. The device of claim 1 , wherein the wavelength converting element is formed separately from the light emitting device and attached to the light emitting device by an adhesive.

4. The device of claim 1 , wherein the second reflective layer is arranged such that a majority of light emitted toward the first sidewall is reflected into the wavelength converting element and a majority of light emitted toward a second sidewall of the wavelength converting element is extracted from the wavelength converting element.

5. The device of claim 1 , wherein the first reflective layer is at least 95% reflective.

6. The device of claim 1 , wherein:

the first reflective layer comprises reflective particles disposed in a transparent molding compound; and

the first reflective layer is molded over the light emitting device.

7. The device of claim 1 , wherein the second reflective layer is disposed adjacent only a single sidewall of the wavelength converting element.

8. The device of claim 1 , wherein the second reflective layer is at least 95% reflective.

9. A method comprising:

attaching a light emitting device to a mount;

forming a first reflective layer contacting and conforming to side surfaces of the light emitting device to laterally surround the light emitting device;

disposing a wavelength converting element over the light emitting device, the wavelength converting element having a top surface and sidewalls, the top surface of the wavelength converting element being higher than the top surface of the first reflective layer; and

forming a second reflective layer adjacent a first sidewall of the wavelength converting element, but not over the top surface or a second sidewall of the wavelength converting element, such that the majority of light exits the top surface of the wavelength converting element and a majority of light impinging on the second reflective layer is reflected back into the wavelength converting element.

10. The method of claim 9 , wherein forming a second reflective layer occurs after forming a first reflective layer.

11. The method of claim 9 , wherein forming a first reflective layer comprises molding and forming a second reflective layer comprises jet dispensing.

12. The method of claim 9 , wherein forming a first reflective layer comprises forming the first reflective layer by a different technique than forming the second reflective layer.

13. The method of claim 9 , wherein disposing a wavelength converting element over the light emitting device comprises gluing a pre-formed wavelength converting element to a top surface of the light emitting device.

14. The method of claim 9 , wherein the second reflective layer is at least 95% reflective.