Chip scale light emitting device package with dome
Light Emitting Devices (LEDs) are fabricated on a wafer substrate with one or more thick metal layers that provide structural support to each LED. The streets, or lanes, between individual LEDs do not include this metal, and the wafer can be easily sliced/diced into singulated self-supporting LEDs. Because these devices are self-supporting, a separate support submount is not required. Before singulation, further processes may be applied at the wafer-level; after singulation, these self-supporting LEDs may be picked and placed upon an intermediate substrate for further processing as required. In an embodiment of this invention, protective optical domes are formed over the light emitting devices at the wafer-level or while the light emitting devices are situated on the intermediate substrate.
1. A method, comprising:
forming a wafer of a plurality of light emitting devices on a first substrate, each of the plurality of light emitting devices separated from each other by a space;
disposing a metal pad layer on the plurality of light emitting devices, such that the metal pad layer includes a space that forms a first metal pad and a second metal pad within each light emitting device;
disposing, on the wafer of plurality of light emitting devices, one or more metal base layers;
disposing a removable material on the one or more metal base layers coincident to the spaces between the plurality of light emitting devices and coincident to the space between the first metal pad and the second metal pad of each light emitting device;
disposing a metal layer over the one or more metal base layers between the removable material;
removing the removable material;
disposing an electrically insulating material in spaces where the removable material was removed; and
removing the first substrate.
2. The method of claim 1 further comprising:
placing the light emitting devices in wells on a second substrate without adhering the light emitting devices to the second substrate; and
encapsulating the light emitting devices with an encapsulant material forming a plurality of encapsulated light emitting devices.
3. The method of claim 2 , further comprising:
removing the second substrate.
4. The method of claim 2 , further comprising:
applying a reflective material to a first surface of the encapsulant material between the encapsulated light emitting devices.
5. The method of claim 2 , further comprising:
singulating the encapsulated light emitting devices to provide individual encapsulated light emitting devices.
6. The method of claim 4 , wherein the applying the reflective material comprises placing the reflective material on a mold and applying the mold to the encapsulant material between the encapsulated light emitting devices.
7. The method of claim 2 , further comprising situating an upper portion of the light emitting devices above a first surface of the second substrate when the light emitting devices are seated in the wells.
8. The method of claim 7 , wherein the encapsulating comprises applying a mold to the light emitting devices on the second substrate forming a plurality of interconnected domes on the light emitting devices.
9. The method of claim 1 , further comprising:
encapsulating each of the plurality of light emitting devices.
10. The method of claim 9 , further comprising:
singulating the light emitting devices in the spaces between the plurality of light emitting devices and through the electrically insulating material.
11. The method of claim 9 , wherein the encapsulating comprises placing a hemispherical dome over each of the plurality of light emitting devices.