LED with stress-buffer layer under metallization layer
Semiconductor LED layers are epitaxially grown on a patterned surface of a sapphire substrate. The patterned surface improves light extraction. The LED layers include a p-type layer and an n-type layer. The LED layers are etched to expose the n-type layer. One or more first metal layers are patterned to electrically contact the p-type layer and the n-type layer to form a p-metal contact and an n-metal contact. A dielectric polymer stress-buffer layer is spin-coated over the first metal layers to form a substantially planar surface over the first metal layers. The stress-buffer layer has openings exposing the p-metal contact and the n-metal contact. Metal solder pads are formed over the stress-buffer layer and electrically contact the p-metal contact and the n-metal contact through the openings in the stress-buffer layer. The stress-buffer layer acts as a buffer to accommodate differences in CTEs of the solder pads and underlying layers.
1. A light-emitting device comprising:
a light-emitting semiconductor structure including a first layer, a second layer, and a third layer, the second layer being disposed between the first layer and the third layer, and the third layer being exposed through an etch that is formed in the first layer and the second layer;
a dielectric layer formed over the light-emitting semiconductor structure;
a first non-planar metal layer that is formed over the dielectric layer and electrically coupled to the first layer;
a second non-planar metal layer that is formed over the dielectric layer and electrically coupled to the third layer;
a stress-buffer layer that is formed of a dielectric polymer, the stress-buffer layer being disposed over the first metal layer and the second metal layer to form a substantially planar surface, the stress-buffer layer being arranged to at least partially fill a trench formed in a periphery of the semiconductor structure that surrounds a central portion of the semiconductor structure; and
a plurality of metal solder pads disposed over the stress-buffer layer, each of the metal solder pads being electrically connected to one of the first metal layer and the second metal layer through a respective opening formed in the stress-buffer layer.
2. The light-emitting of claim 1 , wherein the stress-buffer layer is elastic so as to deform when the metal solder pads expand at a different rate of thermal expansion than their underlying materials.
3. The light-emitting of claim 1 , wherein the stress-buffer layer comprises BenzoCycloButene (BCB).
4. The light-emitting of claim 1 , wherein the first layer includes a p-type layer, the second layer includes an active layer, and the third layer includes an n-type layer.
5. The light-emitting device of claim 1 , further comprising
a metal contact layer electrically contacting the first layer, wherein:
the dielectric layer includes a first opening arranged to expose the metal contact layer, and a second opening arranged to expose the third layer,
the first non-planar metal layer is coupled to the metal contact layer through the first opening in the dielectric layer, and
the second non-planar metal layer is coupled to the third layer through the second opening in the dielectric layer.
6. The light-emitting device of claim 5 , further comprising a passivation layer formed between the stress-buffer layer and the metal contact layer.
7. The light-emitting device of claim 5 , wherein the metal contact layer includes a contact sub-layer coupled to the first layer and an interface sub-layer formed between the contact sub-layer and the solder pads.
8. A light-emitting device comprising:
a light-emitting semiconductor structure including a first layer, a second layer, and a third layer, the second layer being disposed between the first layer and the third layer, and the third layer being exposed through an etch that is formed in the first layer and the second layer;
a dielectric layer formed over the light-emitting semiconductor structure;
a first non-planar metal layer that is formed over the dielectric layer and arranged to electrically contact the first layer;
a second non-planar metal layer that is formed over the dielectric layer and arranged to electrically contact the third layer;
a stress-buffer layer that is formed of a dielectric polymer, the stress-buffer layer being disposed over the first metal layer and the second metal layer to form a surface including at least two openings; and
a plurality of metal solder pads disposed over the stress-buffer layer, each of the metal solder pads being electrically connected to one of the first metal layer and the second metal layer through a respective one of the openings in the surface of the stress-buffer layer.
9. The light-emitting device of claim 8 , wherein the stress-buffer layer is elastic so as to deform when the metal solder pads expand at different rates of thermal expansion than their underlying materials.
10. The light-emitting device of claim 8 , wherein the stress-buffer layer comprises BenzoCycloButene (BCB).
11. The light-emitting device of claim 8 , wherein the first layer includes a p-type layer, the second layer includes an active layer, and the third layer includes an n-type layer.
12. The light-emitting device of claim 8 , wherein the stress-buffer is arranged to fill a trench formed in a periphery of the semiconductor structure that surrounds a central portion of the semiconductor structure.
13. The light-emitting device of claim 8 , further comprising a metal contact layer arranged to electrically contact the first layer.
14. The light-emitting device of claim 13 , wherein:
the dielectric layer includes a first opening arranged to expose the metal contact layer, and a second opening arranged to expose the third layer,
the first non-planar metal layer is arranged to contact the metal contact layer through the first opening in the dielectric layer, and
the second non-planar metal layer is arranged to contact the third layer through the second opening in the dielectric layer.
15. A light-emitting device comprising:
a light-emitting semiconductor structure including a first layer, a second layer, and a third layer, the second layer being disposed between the first layer and the third layer, and the third layer being exposed through an etch that is formed in the first layer and the second layer;
a metal contact layer electrically contacting the first layer;
a dielectric layer formed over the metal contact layer, the dielectric layer having a first opening that exposes the metal contact layer and a second opening that exposes the third layer;
a first non-planar metal layer that contacts the metal contact layer through the first opening in the dielectric layer;
a second non-planar metal layer that contacts the third layer through the second opening in the dielectric layer;
a stress-buffer layer formed of a dielectric polymer and disposed over the first metal layer and the second metal layer, the stress-buffer layer forming a substantially planar surface having two or more openings exposing respective portions of the first metal layer and the second metal layer, the stress-buffer layer being arranged to at least partially fill a trench formed in a periphery of the semiconductor structure that surrounds a central portion of the semiconductor structure; and
a plurality of metal solder pads disposed over the stress-buffer layer, each of the metal solder pads being electrically connected to one of the first metal layer and the second metal layer through a respective one of the openings in the stress-buffer layer.
16. The light-emitting of claim 15 , wherein the stress-buffer layer is elastic so as to deform when the metal solder pads expand at a different rate of thermal expansion than their underlying materials.
17. The light-emitting of claim 15 , wherein the stress-buffer layer comprises BenzoCycloButene (BCB).
18. The light-emitting of claim 15 , wherein the first layer includes a p-type layer, the second layer includes an active layer, and the third layer includes an n-type layer.
19. The light-emitting device of claim 18 , further comprising a passivation layer formed between the stress-buffer layer and the metal contact layer.
20. The light-emitting device of claim 18 , wherein the metal contact layer includes a contact sub-layer coupled to the first layer and an interface sub-layer formed between the contact sub-layer and the solder pads.