Patent Assignment
Reel/Frame 074572/0030
Security Interest
Recorded: 2026-01-30
Received: 2026-01-30
Pages: 67
Assignor
LUMILEDS LLC
Executed: 2026-01-30
Assignee
WILMINGTON SAVINGS FUND SOCIETY, FSB
500 DELAWARE AVENUE, 11TH FLOOR, ATTN: GCM/RAYE GOLDSBOROUGH, WILMINGTON, DE, 19801, UNITED STATES
Covered Properties
(100)
Led Package with Integrated Features for Gas or Liquid Cooling
Application:
15/538,048 →
Light Emitting Device Package
Application:
15/613,951 →
Dimming Led Circuit Augmenting Dc/Dc Controller Integrated Circuit
Application:
15/606,388 →
Method of Forming a Wavelength Converted Light Emitting Device
Application:
15/607,180 →
Led Phosphor Comprising Bow-Tie Shaped A2N6 Building Blocks
Application:
15/526,519 →
Method of Forming a P-Type Layer for a Light Emitting Device
Application:
15/592,658 →
Lighting Device with Ceramic Garnet
Application:
15/525,848 →
Adaptive Light Source
Application:
15/591,040 →
Printed Circuit Board for Integrated Led Driver
Application:
15/587,567 →
Light Emitting Device with Trench Beneath a Top Contact
Application:
15/524,206 →
Multi-Pad, Multi-Junction Led Package
Application:
15/584,546 →
Wavelength Converting Material for a Light Emitting Device
Application:
15/582,042 →
Led with Stress-Buffer Layer Under Metallization Layer
Application:
15/581,204 →
Led Flash Ring Surrounding Camera Lens
Application:
15/496,892 →
Phosphor Converted Led with Temperature Stable Flux and Saturated Red Color Point
Application:
15/521,438 →
Shallow Reflector Cup for Phosphor-Converted Led Filled with Encapsulant
Application:
15/495,425 →
Directional Light Emitting Arrangement and a Method of Producing the Same
Application:
15/520,782 →
Method of Forming a Composite Substrate
Application:
15/482,350 →
Molded Package and Method of Manufacture
Application:
15/517,725 →
Light Source with Tunable Emission Spectrum
Application:
15/513,509 →
Led Disposed in a Body Including a Socket
Application:
15/512,304 →
Quantum Dots in Enclosed Environment
Application:
15/512,434 →
Luminance Pattern Shaping Using a Back-Emitting Led and a Reflective Substrate
Application:
15/510,999 →
Phosphor with Hybrid Coating and Method of Production
Application:
15/510,651 →
Light Emitting Devices with Optical Elements and Bonding Layers
Application:
15/443,902 →
A Light Emitting Device
Application:
15/506,684 →
Light Source
Application:
15/506,663 →
Light Emitting Device with Nanostructured Phosphor
Application:
15/441,176 →
Asymmetrical Light Intensity Distribution from Luminaire
Application:
15/437,872 →
Low Warpage Wafer Bonding Through Use of Slotted Substrates
Application:
15/438,592 →
Sapphire Collector for Reducing Mechanical Damage During Die Level Laser Lift-Off
Application:
15/504,796 →
Chip Scale Light Emitting Device Package with Dome
Application:
15/434,969 →
Led Based Device with Wide Color Gamut
Application:
15/423,495 →
Led Device with Flexible Thermal Interface
Application:
15/501,052 →
Led Package Having Protrusions for Alignment of Package Within a Housing
Application:
15/418,538 →
Silica Coated Quantum Dots with Improved Quantum Efficiency
Application:
15/328,751 →
Siloxane Ligands to Be Used for Dispersing Quantum Dots in Silicone Hosts to Obtain Color Converters for Led Lighting
Application:
15/327,610 →
Light Emitting Diodes and Reflector
Application:
15/326,484 →
Led Light Source for Automotive Application
Application:
15/325,693 →
Vehicle Lighting Module
Application:
15/324,994 →
Retrofit Lamp for Automotive Headlights
Application:
15/324,900 →
Light Source with Quantum Dots
Application:
15/392,286 →
Shaped Phosphor to Reduce Repeated Reflections
Application:
14/912,211 →
Lighting Device with Light Sources Positioned Near the Bottom Surface of a Waveguide
Application:
15/016,019 →
Universal Daytime Running Lamp for Automotive Vehicles
Application:
14/910,194 →
Solid State Illumination Device Having Plasmonic Antenna Array for Anisotropic Emission
Application:
14/909,904 →
Enhanced Emission from Plasmonic Coupled Emitters for Solid State Lighting
Application:
14/909,864 →
Thermal Function of Headlight Sealing Cap
Application:
14/907,894 →
Led Dome with Inner High Index Pillar
Application:
14/907,513 →
Method of Separating Light Emitting Devices Formed on a Substrate Wafer
Application:
14/906,539 →
Flip-Chip Side Emitting Led with Top Reflector, Peripheral Wavelength Conversion Element, and Optical Element Between Light Emitting Element and Lightguide Element
Application:
14/906,533 →
Pc Led with Optical Element and Without Substrate Carrier
Application:
14/906,256 →
Wavelength Converted Light Emitting Device
Application:
14/997,713 →
Dicing a Wafer of Light Emitting Devices
Application:
14/905,865 →
Highly Reflective Flip Chip Led Die
Application:
14/905,959 →
Led Mixing Chamber with Reflective Walls Formed in Slots
Application:
14/996,192 →
Led Having Vertical Contacts Redistributed for Flip Chip Mounting
Application:
14/994,106 →
Wavelength Converted Semiconductor Light Emitting Device
Application:
14/903,727 →
Solder Pad
Application:
29/550,889 →
Solder Pad
Application:
29/550,887 →
Solder Pad
Application:
29/550,880 →
Solder Pad
Application:
29/550,884 →
Led with Stress-Buffer Layer Under Metallization Layer
Application:
14/902,001 →
Bonding LED Die to Lead Frame Strips
Application:
14/901,705 →
Lamp and headlighting arrangement for obtaining a color appearance in an automotive headlight
Application:
14/901,660 →
Light emitting diode device
Application:
14/901,675 →
Reducing Solder Pad Topology Differences by Planarization
Application:
14/392,345 →
P-N Separation Metal Fill for Flip Chip Leds
Application:
14/977,565 →
Led with Patterned Surface Features Based on Emission Field Patterns
Application:
14/900,143 →
Light emitting diode laminated with a phosphor sheet and manufacturing method thereof
Application:
14/896,371 →
Light emitting device with improved extraction efficiency
Application:
14/948,042 →
Contact Etching and Metallization for Improved Led Device Performance and Reliability
Application:
62/258,318 →
Chip Scale Light Emitting Device Package with Dome
Application:
14/892,193 →
Light Emitting Device with an Optical Element and a Reflector
Application:
14/891,332 →
Led with Scattering Features in Substrate
Application:
14/891,344 →
Double-Filament Incandescent Lamp for Automotive Vehicle Front Lighting
Application:
14/891,316 →
Automotive Front Lighting Lamp with Baffle
Application:
14/889,600 →
Islanded Carrier for Light Emitting Device
Application:
14/921,938 →
A light emitting diode component
Application:
14/786,947 →
Side Interconnect for Light Emitting Device
Application:
14/786,522 →
Surface Treatment of a Semiconductor Light Emitting Device
Application:
14/880,242 →
Top emitting semiconductor light emitting device
Application:
14/783,780 →
Led with High Thermal Conductivity Particles in Phosphor Conversion Layer
Application:
14/782,774 →
Method of Attaching a Light Emitting Device to a Support Substrate
Application:
14/869,625 →
Semiconductor Light Emitting Device with Thick Metal Layers
Application:
14/864,862 →
Illumination Device
Application:
14/853,419 →
Light emitting device on a mount with a reflective layer
Application:
14/853,102 →
Semiconductor Light Emitting Device with Light Extraction Structures
Application:
14/837,339 →
Process for Preparing a Semiconductor Structure for Mounting
Application:
14/826,473 →
Light Emitting Device with a Side Reflector
Application:
62/200,490 →
Light Emitting Structure and Mount
Application:
14/764,202 →
Hermetically Sealed Illumination Device with Luminescent Material and Manufacturing Method Therefor
Application:
14/764,216 →
Method and Apparatus for Creating a Porous Reflective Contact
Application:
14/763,879 →
Encapsulated Led Lens with Bottom Reflectors
Application:
14/763,873 →
Encapsulated Quantum Dots in Porous Particles
Application:
14/763,886 →
Automotive Air Purifier
Application:
29/534,275 →
A Coated Luminescent Particle, a Luminescent Converter Element, a Light Source, a Luminaire and a Method of Manufacturing a Coated Luminescent Particle
Application:
14/763,861 →
A Light Emitting Die Component Formed by Multilayer Structures
Application:
14/762,826 →
Led Module with Hermetic Seal of Wavelength Conversion Material
Application:
14/762,576 →
Led Having Etched Light Emitting Surface for Increased Light Extraction
Application:
14/762,568 →