IP Library › Assignment 040073/0013
Patent Assignment
Reel/Frame 040073/0013

Assignment of Assignor's Interest

Recorded: 2016-10-20 Pages: 5
Assignors
SHIRAHATA, TAKAHIRO
Executed: 2016-06-02
ORITA, HIROYUKI
Executed: 2016-06-02
HIRAMATSU, TAKAHIRO
Executed: 2016-06-02
KOBAYASHI, HIROSHI
Executed: 2016-06-02
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1 KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property (1)
Buffer Layer Film-Forming Method and Buffer Layer
Application: 15/305,397 →
Publication: US 2017/0047472
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →