IP Library Granted Patent US 11,075,318
Granted Patent B2
US 11,075,318 · App. 15/305,397 · Granted Jul 27, 2021

Buffer layer film-forming method and buffer layer

Inventors: Takahiro Shirahata (Tokyo, JP); Hiroyuki Orita (Tokyo, JP); Takahiro Hiramatsu (Tokyo, JP); Hiroshi Kobayashi (Tokyo, JP)
Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
H01L31/1884H01L31/022483Y02E10/50
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Quick Facts
Patent No.
US 11,075,318
App. No.
15/305,397
Granted
Jul 27, 2021
Kind
B2
Abstract

A method for film-forming a buffer layer to be used for a solar cell, the buffer layer being disposed between a light absorbing layer and a transparent conductive film. Specifically, in this buffer layer film-forming method, a solution is formed into a mist, the solution containing zinc and almuminum as metal raw materials of the buffer layer. Then, a substrate disposed in the atmosphere is heated. Then, the mist of the solution is sprayed to the substrate being heated.

Claims (13)

1. A method for film-forming a buffer layer to be used for a solar cell, the buffer layer being disposed between a light absorbing layer and a transparent conductive film comprising:

(A) forming a solution containing zinc and aluminum as metal raw materials of the buffer layer into a mist by applying an ultrasonic wave to said solution,

(B) heating a substrate disposed in an atmosphere within a chamber, and

(C) spraying a mist of said solution atomized in said step (A) to said substrate in said step (B),

wherein the buffer layer has a resistivity that is 10Ω·cm or greater.

2. The method for film-forming a buffer layer according to claim 1 further comprising the step of:

(D) supplying ozone to said substrate in said step (B).

3. The method for film-forming a buffer layer according to claim 1 , wherein said solution contains ammonia.

4. The method for film-forming a buffer layer according to claim 1 , wherein said solution contains a metal compound having zinc and aluminum, and said metal compound is a β-diketone compound.

5. The method for firm-forming a buffer layer according to claim 1 , wherein transmittance exceeding 80% is achieved when irradiating the buffer layer with light of a wavelength of between 1500 nm to 1700 nm.

6. A buffer layer to be used for a solar cell, the buffer layer being disposed between a light absorbing layer and a transparent conductive film,

wherein said buffer layer is a Zn 1-x Al x O film containing zinc and aluminum, provided that 0<x<1; and

wherein the buffer layer has a resistivity that is 10Ω·cm or greater.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2016
From: SHIRAHATA, TAKAHIRO; ORITA, HIROYUKI; HIRAMATSU, TAKAHIRO; KOBAYASHI, HIROSHI
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 040073/0013 →
Continuity (1)
Related Publication 20170047472A1 · Feb 16, 2017