Assignment of Assignor's Interest

Recorded: 2016-10-20 Pages: 5

Assignors

TSANG, W. C. PETER

Executed: 2014-03-04

BELL, ANDREW

Executed: 2014-02-27

ZHEN, HONGSHI

Executed: 2014-03-05

SETO, KEITARO

Executed: 2014-02-27

Assignee

PROMERUS, LLC

9921 BRECKSVILLE ROAD, BUILDING R, BRECKSVILLE, OHIO, 44141

Covered Properties (2)

Thermally Decomposable Polymer Compositions for Forming Microelectronic Assemblies

Patent: 9,505,948 →

Application: 14/647,330 →

Publication: US 2015/0299509

Thermally Decomposable Polymer Compositions for Forming Microelectronic Assemblies

Patent: 9,757,818 →

Application: 15/298,824 →

Publication: US 2017/0036308

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.