Patent Assignment
Reel/Frame 040093/0732
Assignment of Assignor's Interest
Recorded: 2016-10-21
Pages: 3
Assignors
FUKAYAMA, SHINYA
Executed: 2016-09-09
KOMUTA, NAOYUKI
Executed: 2016-09-09
WATABE, HIROSHI
Executed: 2016-09-09
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Method and Apparatus for Manufacturing a Semiconductor Device Including a Plurality of Semiconductor Chips Connected with Bumps
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
Merger
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address
Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
Change of Name and Address
Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →