Patent Assignment
Reel/Frame 040117/0633
Assignment of Assignor's Interest
Recorded: 2016-10-25
Pages: 2
Assignors
HUANG, TSUNG-HSIEN
Executed: 2013-09-16
CHENG, HONG-CHEN
Executed: 2013-09-16
LEE, CHENG HUNG
Executed: 2013-09-16
LIAO, HUNG-JEN
Executed: 2013-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Device Having an Inter-Layer via (Ilv), and Method of Making Same