IP Library Assignment 040139/0597
Patent Assignment
Reel/Frame 040139/0597

Assignment of Assignor's Interest

Recorded: 2016-10-26 Pages: 2
Assignors
WENZEL, ROBERT
Executed: 2016-10-18
ZHOU, TINGDONG
Executed: 2016-10-18
CLEGG, DAVID
Executed: 2016-10-18
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST TX30/OE62, AUSTIN, TEXAS, 78735
Covered Property (1)
Package to Board Interconnect Structure with Built-in Reference Plane Structure
Patent: 9,974,174 →
Application: 15/334,734 →
Publication: US 2018/0116050
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →