Patent Assignment
Reel/Frame 040149/0228
Assignment of Assignor's Interest
Recorded: 2016-10-27
Pages: 6
Assignors
HAN, SEONG-CHAN
Executed: 2016-05-07
LEE, YOUNG-ROCK
Executed: 2016-05-09
KANG, CHANG-KUN
Executed: 2016-05-09
LEE, CHIL-HOON
Executed: 2016-05-09
KIM, HAN-JU
Executed: 2016-05-09
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Package