Patent Assignment
Reel/Frame 040155/0282
Assignment of Assignor's Interest
Recorded: 2016-10-27
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device Having Cell Over Periphery (Cop) Structure, Memory Package and Method of Manufacturing the Same