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Patent Assignment
Reel/Frame 040156/0776

Assignment of Assignor's Interest

Recorded: 2016-10-28 Pages: 6
Assignors
SILPACHAI, OHLAN
Executed: 2016-10-21
PERN, NAN JOU
Executed: 2016-10-24
Assignee
MEMSIC, INC.
ONE TECHNOLOGY DRIVE, SUITE 325, ANDOVER, MASSACHUSETTS, 01810
Covered Property (1)
Removable High Flow Impedance Module in Flow Sensor Bypass Circuit
Application: 15/334,697 →
Publication: US 2017/0115149
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2017
From: MEMSIC, INC.
To: ACEINNA, INC.
Reel/Frame 044799/0681 →