Patent Assignment
Reel/Frame 040157/0196
Assignment of Assignor's Interest
Recorded: 2016-10-28
Pages: 7
Assignors
TAK, YONG-SUK
Executed: 2016-06-18
PARK, GI-GWAN
Executed: 2016-07-04
KIM, JIN-BUM
Executed: 2016-06-29
KOO, BON-YOUNG
Executed: 2016-06-27
PARK, KI-YEON
Executed: 2016-06-28
LEE, TAE-JONG
Executed: 2016-06-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Material Layers, Semiconductor Devices Including the Same, and Methods of Fabricating Material Layers and Semiconductor Devices