Patent Assignment
Reel/Frame 040166/0443
Assignment of Assignor's Interest
Recorded: 2016-09-27
Pages: 3
Assignee
NEPES CO., LTD.
74-10, YONGSEONG-RI, SAMSEONG-MYEON, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, 369-834, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Fabrication Method Therefor, and Package-on Package