Patent Assignment
Reel/Frame 040186/0993
Assignment of Assignor's Interest
Recorded: 2016-11-01
Pages: 7
Assignors
SEOK, SEUNG DAE
Executed: 2016-06-27
KIM, SANG YOON
Executed: 2016-06-27
KIM, HUI JAE
Executed: 2016-06-27
SHIN, JAE BONG
Executed: 2016-06-27
LEE, BYUNG JOON
Executed: 2016-06-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Stage and Bonding Apparatus Comprising the Same