Patent Assignment
Reel/Frame 040202/0553
Assignment of Assignor's Interest
Recorded: 2016-11-02
Pages: 4
Assignor
IKOMA, KAZUYA
Executed: 2016-08-31
Assignee
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI, KYOTO, 615-8585, JAPAN
Covered Property
(1)
Method for Manufacturing Wire Bonding Structure, Wire Bonding Structure, and Electronic Device