Patent Assignment
Reel/Frame 040212/0480
Assignment of Assignor's Interest
Recorded: 2016-11-03
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
3D Chip Assemblies Using Stacked Leadframes
Patent:
9,917,041 →
Application:
15/338,162 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.