Patent Assignment
Reel/Frame 072890/0093
Assignment of Assignor's Interest
Recorded: 2025-09-18
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(25)
Method and System for Booting a Software Package on a Network Processor
Technologies for Providing Cross Data Storage Device Communications
Local Stress-Relieving Devices, Systems, and Methods for Electronic Assemblies
3D Chip Assemblies Using Stacked Leadframes
Patent:
9,917,041 →
Application:
15/338,162 →
Technologies for Management of Lookup Tables
Device, System and Method for Providing on-Chip Test/Debug Functionality
Temperature Management of Electronic Circuitry of Electronic Devices, Memory Devices, and Computing Devices
Combinatorial Magneto Electric Spin Orbit Logic
Memory Including a Perovskite Material
Memory Structures Having Improved Write Endurance
Dual Rdl Stacked Die Package Using Vertical Wire
Integrated Electronic Card Front Emi Cage and Latch for Data Storage System
Package Substrate with High-Density Interconnect Layer Having Pillar and via Connections for Fan Out Scaling
Differential Trench Fill for Ease of Layout Design
Combined Secure Mac and Device Correction Using Encrypted Parity with Multi-Key Domains
Electronic Device Package with Reduced Thickness Variation
Snap-On Electromagnetic Interference (Emi)-Shielding Without Motherboard Ground Requirement
Fabricating an Rf Filter on a Semiconductor Package Using Selective Seeding
Connector with Active Circuit
Register Sharing Mechanism
High Bandwidth Destructive Read Embedded Memory
Apparatuses, Systems, and Methods to Store Pre-Read Data Associated with a Modify-Write Operation
Field-Effect Transistors with Dual Thickness Gate Dielectrics
Encoded on-Die Termination for Efficient Multipackage Termination
Power and Thermal Management in a Solid State Drive
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 16, 2006
From: XU, BING TAO; VOLKENING, INGO
To: INFINEON TECHNOLOGIES AG
Reel/Frame 017625/0081 →
Assignment of Assignor's Interest
Jun 3, 2010
From: INFINEON TECHNOLOGIES AG
To: INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
Reel/Frame 024474/0937 →
Assignment of Assignor's Interest
Jun 15, 2010
From: INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
To: LANTIQ DEUTSCHLAND GMBH
Reel/Frame 024529/0614 →
Grant of Security Interest in U.S. Patents
Nov 29, 2010
From: LANTIQ DEUTSCHLAND GMBH
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 025406/0677 →
Release of Security Interest Recorded at Reel/Frame 025413/0340 and 025406/0677
Apr 17, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 035453/0712 →
Assignment of Assignor's Interest
Sep 28, 2016
From: RAMALINGAM, ANAND S.
To: INTEL CORPORATION
Reel/Frame 040166/0565 →
Assignment of Assignor's Interest
Oct 1, 2016
From: CAI, YUHONG; LAI, MIN-TIH; CHOW, GARRICK; FAN, LIANHUA
To: INTEL CORPORATION
Reel/Frame 039916/0745 →
Assignment of Assignor's Interest
Nov 3, 2016
From: RUNYAN, CORY A.; PON, FLORENCE R.
To: INTEL CORPORATION
Reel/Frame 040212/0480 →
Assignment of Assignor's Interest
Jan 30, 2017
From: MAROHN, BYRON; MACIOCCO, CHRISTIAN; GOBRIEL, SAMEH; WANG, REN
To: INTEL CORPORATION
Reel/Frame 041124/0350 →
Assignment of Assignor's Interest
Apr 12, 2017
From: PAPPU, LAKSHMINARAYANA; BHATT, SUKETU; CHELLAPPAN, SATHEESH
To: INTEL CORPORATION
Reel/Frame 041987/0582 →
Merger
Dec 18, 2017
From: LANTIQ DEUTSCHLAND GMBH
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 044907/0045 →
Merger and Change of Name
Jan 17, 2018
From: LANTIQ DEUTSCHLAND GMBH; LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 045085/0292 →
Assignment of Assignor's Interest
Sep 27, 2018
From: PILLARISETTY, RAVI; SHARMA, ABHISHEK A.; KARPOV, ELIJAH V.; MAJHI, PRASHANT
To: INTEL CORPORATION
Reel/Frame 046993/0679 →
Assignment of Assignor's Interest
Dec 17, 2018
From: LIN, CHIA-CHING; MANIPATRUNI, SASIKANTH; GOSAVI, TANAY; NIKONOV, DMITRI
To: INTEL CORPORATION
Reel/Frame 047790/0801 →
Assignment of Assignor's Interest
Apr 17, 2019
From: LEE, JAEJIN; LIAO, JUN; LI, XIANG; COX, CHRISTOPHER E.
To: INTEL CORPORATION
Reel/Frame 048915/0917 →
Assignment of Assignor's Interest
May 2, 2019
From: MAY, ROBERT ALAN; BOYAPATI, SRI RANGA SAI; DARMAWIKARTA, KRISTOF KUWAWI; PIETAMBARAM, SRINIVAS V.
To: INTEL CORPORATION
Reel/Frame 049068/0502 →
Assignment of Assignor's Interest
Jun 5, 2019
From: LI, YONGGANG; MARIN, BRANDON C; PARICHEHREH, VAHIDREZA; ECTON, JEREMY D
To: INTEL CORPORATION
Reel/Frame 049376/0008 →
Assignment of Assignor's Interest
Nov 15, 2019
From: KIM, HYOUNG IL
To: INTEL CORPORATION
Reel/Frame 051024/0910 →
Assignment of Assignor's Interest
Nov 19, 2019
From: LEE, CHEN-GUAN
To: INTEL CORPORATION
Reel/Frame 051060/0377 →
Assignment of Assignor's Interest
Jan 3, 2020
From: DEUTSCH, SERGEJ; WU, WEI; DURHAM, DAVID M.; GREWAL, KARANVIR
To: INTEL CORPORATION
Reel/Frame 051413/0960 →
Assignment of Assignor's Interest
Jul 13, 2020
From: LIU, HUICHU; MORRIS, DANIEL; KARNIK, TANAY; MANIPATRUNI, SASIKANTH
To: INTEL CORPORATION
Reel/Frame 053191/0398 →
Assignment of Assignor's Interest
Dec 7, 2020
From: SARPATWARI, KARTHIK; COLLINS, DALE; GEALY, FRED DANIEL, III; LENGADE, SWAPNIL
To: INTEL CORPORATION
Reel/Frame 054564/0364 →
Change of Name
Apr 6, 2022
From: LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: INTEL GERMANY GMBH & CO. KG
Reel/Frame 059645/0263 →
Assignment of Assignor's Interest
Mar 17, 2026
From: INTEL GERMANY GMBH & CO. KG
To: INTEL CORPORATION
Reel/Frame 074104/0401 →