IP Library Assignment 051060/0377
Patent Assignment
Reel/Frame 051060/0377

Assignment of Assignor's Interest

Recorded: 2019-11-19 Pages: 3
Assignor
LEE, CHEN-GUAN
Executed: 2019-03-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Differential Trench Fill for Ease of Layout Design
Application: 16/354,741 →
Publication: US 2020/0294986
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072890/0093 →