Patent Assignment
Reel/Frame 051024/0910
Assignment of Assignor's Interest
Recorded: 2019-11-15
Pages: 3
Assignor
KIM, HYOUNG IL
Executed: 2019-01-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Dual Rdl Stacked Die Package Using Vertical Wire
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.