Patent Assignment
Reel/Frame 049376/0008
Assignment of Assignor's Interest
Recorded: 2019-06-05
Pages: 4
Assignors
LI, YONGGANG
Executed: 2019-04-08
MARIN, BRANDON C
Executed: 2019-04-08
PARICHEHREH, VAHIDREZA
Executed: 2019-04-08
ECTON, JEREMY D
Executed: 2019-04-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Electronic Device Package with Reduced Thickness Variation
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.