IP Library › Assignment 040225/0364
Patent Assignment
Reel/Frame 040225/0364

Assignment of Assignor's Interest

Recorded: 2016-11-04 Pages: 3
Assignors
STUBER, MICHAEL A.
Executed: 2012-12-20
MOLIN, STUART B.
Executed: 2012-12-20
Assignee
IO SEMICONDUCTOR, INC
4350 EXECUTIVE DRIVE, SUITE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Back-to-back stacked integrated circuit assembly
Patent: 9,576,937 →
Application: 15/130,721 →
Publication: US 2016/0233198
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 4, 2016
From: QUALCOMM SWITCH CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 040227/0291 →
Change of Name Nov 4, 2016
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 040569/0182 →
Change of Name Nov 4, 2016
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: QUALCOMM SWITCH CORP.
Reel/Frame 040569/0213 →