IP Library › Assignment 040240/0790
Patent Assignment
Reel/Frame 040240/0790

Change of Name

Recorded: 2016-10-05 Pages: 31
Assignor
Assignee
RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
111, NISHI YOKOTE-MACHI, TAKASAKI-SHI, GUNMA, JAPAN
Covered Properties (7)
Method of Manufacturing a Semiconductor Device
Patent: 7,033,857 →
Application: 10/462,463 →
Publication: US 2004/0038510
Method of Manufacturing a Semiconductor Device
Patent: 7,384,820 →
Application: 11/360,512 →
Publication: US 2006/0141677
Method of Manufacturing a Semiconductor Device
Patent: 7,579,216 →
Application: 12/118,752 →
Publication: US 2008/0286902
Method of Manufacturing a Semiconductor Device
Patent: 7,816,185 →
Application: 12/534,183 →
Publication: US 2009/0291529
Method of Manufacturing A Semiconductor Device
Patent: 8,877,613 →
Application: 12/894,987 →
Publication: US 2011/0020984
Method of Manufacturing a Semiconductor Device
Application: 14/490,254 →
Publication: US 2015/0004755
Method of Manufacturing a Semiconductor Device
Patent: 9,805,980 →
Application: 14/995,185 →
Publication: US 2016/0133521
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Oct 5, 2016
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 040240/0734 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Change of Address Dec 7, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044742/0288 →