Patent Assignment
Reel/Frame 040261/0974
Assignment of Assignor's Interest
Recorded: 2016-11-09
Pages: 7
Assignors
KANG, SHIN-HWAN
Executed: 2016-10-12
SON, YOUNG-HWAN
Executed: 2016-10-12
EUN, DONG-SEOG
Executed: 2016-10-12
LEE, CHANG-SUP
Executed: 2016-10-12
JANG, JAE-HOON
Executed: 2016-10-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including Vertical Memory Device and Method of Manufacturing the Same