Patent Assignment
Reel/Frame 040262/0020
Assignment of Assignor's Interest
Recorded: 2016-11-09
Pages: 4
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83706
Covered Property
(1)
Method of Forming a Metal Seed Layer for Subsequent Plating
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.