Patent Assignment
Reel/Frame 040281/0351
Assignment of Assignor's Interest
Recorded: 2016-11-10
Pages: 7
Assignors
YIM, TAE-JIN
Executed: 2016-02-11
AHN, SANG-HOON
Executed: 2016-02-11
OSZINDA, THOMAS
Executed: 2016-02-11
BAEK, JONG-MIN
Executed: 2016-02-11
KIM, BYUNG HEE
Executed: 2016-02-11
LEE, NAE-IN
Executed: 2016-02-11
JUN, KEE-YOUNG
Executed: 2016-02-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Copper via with Barrier Layer and Cap Layer