Patent Assignment
Reel/Frame 040308/0364
Assignment of Assignor's Interest
Recorded: 2016-11-14
Pages: 3
Assignor
LEE, CHIH CHENG
Executed: 2016-11-10
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Substrate, Semiconductor Package Structure and Manufacturing Process