Patent Assignment
Reel/Frame 040308/0991
Assignment of Assignor's Interest
Recorded: 2016-11-14
Pages: 4
Assignors
TSAI, YI-DA
Executed: 2016-11-04
LIN, CHENG-PING
Executed: 2016-11-04
LIN, WEI-HUNG
Executed: 2016-11-04
LIN, CHIH-WEI
Executed: 2016-11-04
CHENG, MING-DA
Executed: 2016-11-04
HSIEH, CHING-HUA
Executed: 2016-11-04
LIU, CHUNG-SHI
Executed: 2016-11-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same