Patent Assignment
Reel/Frame 040313/0454
Assignment of Assignor's Interest
Recorded: 2016-11-14
Pages: 11
Assignors
SOLIMANDO, MICHAEL JAMES
Executed: 2016-10-12
STONE, WILLIAM
Executed: 2016-10-12
HOLMES, JOHN
Executed: 2016-10-12
HEALY, CHRISTOPHER
Executed: 2016-10-12
PENDSE, RAJENDRA
Executed: 2016-10-12
YUN, SUN
Executed: 2016-10-19
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Package on Package (Pop) Device Comprising Thermal Interface Material (Tim) in Cavity of an Encapsulation Layer