Patent Assignment
Reel/Frame 040326/0101
Assignment of Assignor's Interest
Recorded: 2016-11-15
Pages: 8
Assignors
KIM, JIN-BUM
Executed: 2016-06-02
KANG, MYUNG-GIL
Executed: 2016-05-30
MOON, KANG-HUN
Executed: 2016-06-02
LEE, CHO-EUN
Executed: 2016-05-30
JUNG, SU-JIN
Executed: 2016-06-02
CHOI, MIN-HEE
Executed: 2016-05-30
XU, YANG
Executed: 2016-05-30
SHIN, DONG-SUK
Executed: 2016-06-02
LEE, KWAN-HEUM
Executed: 2016-06-02
CHUNG, HOI-SUNG
Executed: 2016-06-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices with Layers Commonly Contacting Pins and Methods of Manufacturing the Same