IP Library › Assignment 040346/0217
Patent Assignment
Reel/Frame 040346/0217

Assignment of Assignor's Interest

Recorded: 2016-11-16 Pages: 5
Assignors
LEE, YONG KOON
Executed: 2016-09-08
SEOL, YONG JIN
Executed: 2016-09-08
LEE, SANG KYU
Executed: 2016-09-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package and Method of Manufacturing Same
Patent: 9,899,331 →
Application: 15/353,249 →
Publication: US 2017/0287839
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →