Patent Assignment
Reel/Frame 040359/0850
Assignment of Assignor's Interest
Recorded: 2016-11-17
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure Including Redistribution Structure and Conductive Shielding Film