Patent Assignment
Reel/Frame 040373/0331
Assignment of Assignor's Interest
Recorded: 2016-11-18
Pages: 2
Assignor
HSIEH, CHENG-CHIEH
Executed: 2016-11-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Packaging Device with Heat Sink