IP Library Assignment 040394/0597
Patent Assignment
Reel/Frame 040394/0597

Assignment of Assignor's Interest

Recorded: 2016-11-21 Pages: 4
Assignors
TRUHITTE, DARRELL D.
Executed: 2016-11-07
LETTERMAN, JAMES P., JR.
Executed: 2016-11-21
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Methods of Forming Leadless Semiconductor Packages with Plated Leadframes and Wettable Flanks
Application: 15/357,680 →
Publication: US 2018/0145013
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →