Patent Assignment
Reel/Frame 040406/0467
Assignment of Assignor's Interest
Recorded: 2016-11-22
Pages: 4
Assignors
CHEN, CHIH-LIN
Executed: 2016-11-08
TSAI, CHUNG-HAO
Executed: 2016-11-08
HSIEH, JENG-SHIEN
Executed: 2016-11-08
WANG, CHUEI-TANG
Executed: 2016-11-08
YU, CHEN-HUA
Executed: 2016-11-08
CHANG, CHIH-YUAN
Executed: 2016-11-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package Structure with Inductor and Method of Forming Thereof