Patent Assignment
Reel/Frame 040407/0292
Assignment of Assignor's Interest
Recorded: 2016-11-23
Pages: 7
Assignors
RYU, SEUNG-KWAN
Executed: 2016-07-21
KWON, YONGHWAN
Executed: 2016-07-18
CHOI, YUN SEOK
Executed: 2016-07-18
JO, CHAJEA
Executed: 2016-07-18
CHO, TAEJE
Executed: 2016-07-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same