Patent Assignment
Reel/Frame 040413/0429
Assignment of Assignor's Interest
Recorded: 2016-11-23
Pages: 3
Assignor
JOBETTO, HIROYASU
Executed: 2005-03-18
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Fabricating a Semiconductor Device Incorporating a Semiconductor Constructing Body and an Interconnecting Layer Which Is Connected to a Ground Layer via a Vertical Conducting Portion
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Ownership by Corporate Separation
Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812
Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Assignment of Assignor's Interest
Nov 23, 2016
From: CASIO COMPUTER CO., LTD.
To: CASIO COMPUTER CO., LTD.; CMK CORPORATION
Reel/Frame 040413/0485 →
Merger
Nov 30, 2016
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 040769/0853 →
Assignment of Assignor's Interest
Jan 30, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041123/0931 →