Patent Assignment
Reel/Frame 040413/0709
Assignment of Assignor's Interest
Recorded: 2016-11-23
Pages: 4
Assignors
YANG, TAI-I
Executed: 2016-11-18
CHU, WEI-CHEN
Executed: 2016-11-18
CHEN, HSIN-PING
Executed: 2016-11-18
LU, CHIH-WEI
Executed: 2016-11-18
LEE, CHUNG-JU
Executed: 2016-11-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Interconnect Structure Including Air Gap