Patent Assignment
Reel/Frame 040425/0030
Assignment of Assignor's Interest
Recorded: 2016-11-28
Pages: 9
Assignors
HUANG, CHANG-CHIA
Executed: 2016-09-02
LIN, TSUNG-SHU
Executed: 2016-08-30
CHENG, MING-DA
Executed: 2016-08-30
LU, WEN-HSIUNG
Executed: 2016-10-31
SU, BOR-RUNG
Executed: 2016-10-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaging Device and Method of Making the Same