Patent Assignment
Reel/Frame 040434/0957
Assignment of Assignor's Interest
Recorded: 2016-11-28
Pages: 4
Assignors
KAO, JEN-CHIEH
Executed: 2016-11-22
YEH, CHANG-LIN
Executed: 2016-11-22
CHEN, YI
Executed: 2016-11-22
CHIANG, SUNG-HUNG
Executed: 2016-11-22
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Including Filling Mold Via