Patent Assignment
Reel/Frame 040455/0789
Assignment of Assignor's Interest
Recorded: 2016-11-29
Pages: 6
Assignors
LEE, HYOUNGJOO
Executed: 2016-02-16
KIM, MINSOO
Executed: 2016-02-16
LEE, TEAK HOON
Executed: 2016-02-16
JEE, YOUNG KUN
Executed: 2016-02-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Fabricating the Same