Patent Assignment
Reel/Frame 040456/0298
Assignment of Assignor's Interest
Recorded: 2016-11-29
Pages: 6
Assignors
PARK, MYEONG-SOON
Executed: 2016-02-19
CHUNG, HYUN-SOO
Executed: 2016-02-19
LEE, CHAN-HO
Executed: 2016-02-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Including Chip Pad, Redistribution Wiring Test Pad, and Redistribution Wiring Connection Pad