Patent Assignment
Reel/Frame 040469/0494
Assignment of Assignor's Interest
Recorded: 2016-11-30
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Assemblies with System-on-Chip (Soc) Packages