Patent Assignment
Reel/Frame 040491/0953
Assignment of Assignor's Interest
Recorded: 2016-12-02
Pages: 5
Assignors
CHANG, SHOU-ZEN
Executed: 2016-11-29
TSAI, CHUNG-HAO
Executed: 2016-11-29
WANG, CHUEI-TANG
Executed: 2016-11-29
WU, KAI-CHIANG
Executed: 2016-11-29
LIU, MING-KAI
Executed: 2016-11-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, , TAIWAN 300-78, R.O.C., HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method of Fabricating the Same