Patent Assignment
Reel/Frame 040595/0345
Assignment of Assignor's Interest
Recorded: 2016-12-08
Pages: 3
Assignee
SHENZHEN HUIDING TECHNOLOGY CO., LTD.
FLOOR 13, PHASE B, TENGFEI INDUSTRIAL BUILDING, FUTIAN FREE TRADE ZONE, SHENZHEN, 518000, CHINA
Covered Property
(1)
Chip Packaging Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.