Patent Assignment
Reel/Frame 040604/0390
Assignment of Assignor's Interest
Recorded: 2016-12-08
Pages: 2
Assignee
TSC INC.
362-17 TOSEONG-RO, HYANGNAM-EUP, HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chemical-Mechanical Wafer Polishing Device