Patent Assignment
Reel/Frame 040605/0650
Assignment of Assignor's Interest
Recorded: 2016-12-08
Pages: 4
Assignor
KO, JUNYOUNG
Executed: 2016-04-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Semiconductor Package