Patent Assignment
Reel/Frame 040661/0661
Assignment of Assignor's Interest
Recorded: 2016-12-19
Pages: 2
Assignors
IMAFUJI, KEI
Executed: 2016-10-14
YOSHIZAWA, KEIJI
Executed: 2016-10-14
YOSHINO, HIROKAZU
Executed: 2016-10-14
UCHIYAMA, KENTA
Executed: 2016-10-24
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Semiconductor Device